Department of Mechanical and Process Engineering

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The Department of Mechanical and Process Engineering (D-MAVT) is one of 16 departments at ETH Zurich. The history of D-MAVT dates back to the founding of ETH Zurich in 1855. The Department has played a significant role in Swiss and global technological development.

D-MAVT's current research and educational programme is so diverse that rather than representing the department through its key technological aspects, we have decided to show at least one area of work by each professor: www.mavt.ethz.ch

The individual work profiles present the following:

D-MAVT ALPS II, laser produced plasma light sourceDetails of HyQ blue`s hydraulic leg actuation system. HyQ blue is supported by the Istituto Italiano di Tecnologia and the Swiss National Science Foundation.Four quadrocopters in the Flying Machine ArenaSetup to test new sound absorbing materialsIn-Line or Laboratory Viscosity Measurement Using a Vibrating BeamA vibrating U structure is interacting with a fluid in a microcavity for very high sensitivity viscosity measurements with small sample volumesPhononic crystal with adaptive topologyMulti-stable composites with integrated piezoelectric actuatorsFormula hybrid vehicleTest setup for Newton’s cradle with five ballsElliptic Lagrangian transport barriers in a chaotic, three-dimensional fluid flow. Clean working area for processes of photolithography. At the cleanroom of the Binnig and Rohrer Nanotechnology Center (BRNC) at Rüschlikon, wafers are coated with photoresist and baked at particularly controlled ambient conditions: Low number of particles in the air, stabilized humidity and room temperature, as well as UV-free illumination.  Electrical measurements by metal probes. Electronic devices are tested at a point probe station. The contact areas are small and require an optical microscope for placement of the probe tips.New experimental test for the detection of frictional behaviorELBM simulation of turbulent flow past a surface-mounted cubeWavy vortices in the flow between two concentric rotating cylindersVortex breakdown in swirling nozzle-jet flowPFLOPs simulations of Cloud Cavitation CollapseSimulation of the finite-time singularity of the Euler diskSet-up for in-situ measurements in the multiphoton microscopePrototype for an adjustable damping element, based on the activation of magnetorheological fluid.Development of novel CO2 sorbentsGranular systems: Formation of surface waves in vibrated beds The OctoMag with ophthalmoscope for microrobotic retinal surgerySynthesis of colloidal semiconductor nanocrystalsHigh-sensitivity plasmonic (SERS) sensor shown alongside gold-dielectric-CNT nanowiresA network of thermoresistive sensors inside the MiniPanda containment test facility at ETH ZurichManufacturing of up to 5 kg/h of ceramic, nutritional and other nanoparticlesThe Institute of Fluiddynamics operates several wind and water tunnel facilities for fundamental and applied research in fluid dynamics.Plasma through surface dielectric barrier dischargeComplex technical systems: streetcar network. In this picture, the topological structure of the streetcar network of Milano is portrayed.Design-to-Fabrication: Exploiting new fabrication capabilities in designStarlETH, the running quadrupedA solar thermochemical reactor prototype for splitting H2O and CO2 via redox cycles, exposed to concentrated solar radiation.Pentacene field-effect transistor made from linked gold nanorods (in collaboration with IBM Research - Zurich).Ultraprecision  milling machine with planar guidingMiniature hopping robot driven by a micro motor and solar panelThe simulation result shows unstable sub-surface mixing of heavy (top) and light (below, in blue) fluids, such as when CO2 dissolves in water (becoming heavier than pure water) and this mixture is consequently driven down. This result has major significance for the storage of CO2 in geological formations.Phase Doppler Anemometry (PDA) measurements in a large spray combustion chamber.3D-integrated cooling of electronics: Micro-PIV and Micro-LIF measurements of 3D-integrated electronic chip stacks.
 
 
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Thu Aug 17 05:35:39 CEST 2017
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